All3D PrintingCleanroomElectronic PackagingMaterials CharacterizationStaff Scanning Electron Microscope Transmission Electron Microscope Sample Prep Room Access Thermal Processes Atomic Force Microscopy (AFM) Low Resolution SEM Energy Dispersive X-ray Spectroscopy (EDS) X-Ray Diffraction (XRD) Differential Scanning Calorimetry (DSC) SDT Focused Ion Beam (FIB) Microscopy Sample Coating (Au) Microscopy Sample Coating (C) Screen Printer Cutting Laser Training Engineering Services Analytical Services Tool Operation/ Gen. Labor MTS Tensile Tester Omniprobe Vickers Hardness Test DRIE Dicing Saw Clean Room Access (10 hr minimum) Ebeam Lithography Photolithography Laser Lithography UPG101 Parlyene Coating Reactive Ion Etching (RIE) Ashing PVD; Sputtering (Base Metals) PVD; Evaporation (Base Metals) RTA Wedge Bonder PECVD Hyrel Systems30M Formlabs Form 1+
