Material Characterization


Material Characterization

  • Phillips CM-200 200 kV Transmission Electron Microscope (TEM) with Energy Dispersive Spectroscopy (EDS).
  • JEOL 6330F Field Emission Scanning Electron Microscopy (FEG-SEM) with Energy Dispersive Spectroscopy (EDS)
  • JEOL Multi Beam FIB
  • Vecco Atomic Force Microscope (AFM)
  • Buehler Versamet 3 Metallograph with Image-Pro Plus® 5.1 Image Analysis Software
  • Siemens 500D X-ray Diffractometer (XRD) with residual stress measurement and high temperature capabilities.
  • TA Instruments DSC 2910 Differential Scanning Calorimeter.
  • TA Instruments DMA983 Dynamic Mechanical Analyzer.
  • TA Instruments TGA 2950 Thermogravimetric Analyzer.
  • Theta Dilatometer Analyzer.
  • Versamet Optical Microscope with Integrated Image Analysis System.
  • Complete metallography facility with cutting, mounting, and polishing equipment
  • Buehler Electropolishing and etching
  • JEOL Dual Focused Ion Beam
  • Nanovea Optical Profilometer

Mechanical Testing

  • Instron Model 1331 – 20,000 lb, 20kips Cyclic Tester with 8500 Computer Controller.
  • Knoop Microhardness Tester
  • Rockwell Hardness Tester
  • Micro Photonics MP-100TC Digital Microhardness Tester

Nanomechanics and Nanotribology Laboratory

  • Hysitron TI 900 Triboindenter
  • In-situ Scanning Probe Microscope (SPM) Imaging
  • Nano DMA
  • Modulus mapping module
  • Scanning Probe Image Processor (SPIP) software

Furnaces

  • Ionex Tensvac II 2500oC High-Temperature Vacuum Furnace
  • Thermolyne 1700oC High -Temperature Furnace.
  • Lindberg 1200oC High -Temperature Tube Furnace.
  • Vacuum Arc-Melting Furnace.
  • Vacuum Heat Treatment System.

Nanofabrication

  • 350 sq. ft. class 100 clean room
  • 1200 sq. ft. class 10,000 clean room
  • Deep reactive ion etcher – STS Multiplex
  • 10 KeV four pocket e-beam deposition system with planetary and residual gas monitoring
  • 3 sputtering systems, all cryopumped
  • March Reactive Ion Etcher
  • Atomic force microscope
  • Profilometry
  • Thin film thickness, reflectance, and transmittance
  • 3 and 6” tube furnaces
  • Photoresist spinner and dryers (2)
  • Critical point dryer
  • JEOL 7000 F SEM with e-beam Nanolithography facility (20 nm feature)
  • OAI Model 800 Mask Aligner with NLS nanoimprinting module
  • NLS AR-STA-100 Nanoimprint sample treatment system
  • CVD furnace for CNT
  • Micro Probe Station
  • Magnetron Sputter
  • Multi-mode AFM/MFM/STM Probe System
  • HO Magnetometer
  • Measurement Spin-Stand

Packaging

  • High speed (100,000 rpm) OZO micro-router/drill for hole drilling (.006 min) and depaneling
  • MPM screen printer, with vacuum pull down for via filling
  • PTC isostatic laminator
  • Uniaxial laminator
  • Firing furnaces (controlled ramp (1oC/min), air, vacuum.
  • Controlled atmosphere, hydrogen to 1600oC), with optical camera monitoring.
  • Ceramic lapping
  • Hughes micro welder/soldering station, manual pick and place with epoxy dispense.
  • Complete screen fabrication, thru hole plating facility (electroless/electroplating with pulse power supply)
  • Photoresist – spinner, controlled extraction
  • Dry film and exposure system, thin film deposition (laser ablation, sputtering, filament, and e-beam).
  • Complete tape manufacturing (ball mills, three roll mill, cup and cone viscometer, tape casting)
  • Full high frequency testing includes three Agilent network analyzers (6GHz, 26GHz, 110GHz)
  • Wiltron RF test fixture and a time domain reflectometer.
  • Sonnet microwave design, Pro-E solid modeling, CFDRC Fluid modeling, and Harvard Thermal Analysis

Remotely Accessible Tools

  • Phenom table top SEM
  • JEOL SIB-4500 multibeam SEM/FIB (with EDS)
  • JEOL 7000 SEM
  • JEOL 6335F SEM with EDS
  • Atomic Force Microscope
  • Laser Pattern generator / mask maker
  • WDS (VIA FCAEM)

Rapid Prototyping

3D Printing

  • Makerbot Replicator 2 (Fused Deposition Modeling): Single Extruder printer.
  • Leapfrog Xeed (Fused Deposition Modeling): Dual Extruder printer with PVA dissolvabe support option.
  • Capable of printing large objects with 10 micron mininmum feature size and 5 micron thick layers.
  • FormLabs Form 1+ (Stereolithography): High Resolution printer capable of 25 micron layer height.

3D Scanner

  • NextEngine: High resolution scanning up to 60,000 data points per square inch. Capable of scanning large objects.

© FIU AMERI 2016