Electronic Packaging Technology


The AMERI ElectronicPackaging Facility is a comprehensive electronic packaging and ceramic systems processing facility. Package design and materials systems solutions are available for a wide range of project needs.  Let us help you take your project from dicing to application with a custom engineered package.

Capabilities

  • Materials formulation and analysis
  • Thick film shaping, metallization, and firing
  • 50um thru via punching and 1um stack alignment
  • Custom device packaging solutions
  • HTCC and LTCC materials systems
  • Custom material systems development
  • Thick film casting and processing
  • 3D printable metal ink, ceramic paste, and sacrificial material systems development

Click here for Electronic Packaging Equipment List


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