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Advanced Materials Engineering Research Institute
  • About Us
    • About Us
    • NSF’s ERC
    • FAQs
    • Archives
  • Resources
    • Facilities & Services
    • Nanotechnology Related Resources
  • AMERI 2022 Conference
    • Abstract Submission
  • Contact Us
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DRIE

DRIE

Dicing Saw

Dicing Saw

Clean Room Access (10 hr minimum)

Clean Room Access (10 hr minimum)

Ebeam Lithography

Ebeam Lithography

Photolithography

Photolithography

Laser Lithography UPG101

Laser Lithography UPG101

Parlyene Coating

Parlyene Coating

Reactive Ion Etching (RIE)

Reactive Ion Etching (RIE)

Ashing

Ashing

PVD; Sputtering (Base Metals)

PVD; Sputtering (Base Metals)

PVD; Evaporation (Base Metals)

PVD; Evaporation (Base Metals)

RTA

RTA

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